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TS991SNL35T3
TS991SNL35T3Reference image

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Mfr. #:
TS991SNL35T3
Batch:
new
Description:
No-clean solder paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (34.869g)
Datasheet:
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Specifications
frequently asked question
Product AttributeAttribute Value
Manufacturer Chip Quik Inc.
Series CHIPQUIK?
Packaging Bulk
Type Solder Paste
Ingredients Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter -
Melting Point 423°F (217°C)
Flux Type No Clean
Wire Gauge -
Mesh Type 3
Process -
Form Factor Syringe, 1.23 oz (34.869g)
Shelf Life 12 Months
Shelf Life Start Date Manufacturing Date
Storage/Refrigeration Temperature 37°F ~ 77°F (3°C ~ 25°C)
Shipping Information -
Weight -
Other product information

Advantage price,TS991SNL35T3 in stock can be shipped on the same day

In Stock: 19
Qty.Unit PriceExt. Price
1+ $63.3949 $63.3949
5+ $58.1174 $290.587
10+ $50.1918 $501.918
25+ $44.9089 $1122.7225
50+ $42.2672 $2113.36
100+ $39.6254 $3962.54
Enter Quantity:
Unit Price:
$0.47
Ext. Price:
$0.94
In Stock:
19
Minimum:
1
MPQ:
1
Multiples:
1
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