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TS391SNL500C
TS391SNL500CReference image

Images are for reference only

Mfr. #:
TS391SNL500C
Batch:
new
Description:
Lead-free No-clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Box, 17.64 oz (500g)
Datasheet:
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Specifications
frequently asked question
Product AttributeAttribute Value
Manufacturer Chip Quik Inc.
Series -
Packaging Bulk
Type Solder Paste
Ingredients Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter -
Melting Point 423 ~ 428°F (217 ~ 220°C)
Flux Type No Clean
Wire Gauge -
Mesh Type 4
Process Lead Free
Form Factor Box, 17.64 oz (500g)
Shelf Life 12 Months
Shelf Life Start Date Manufacturing Date
Storage/Refrigeration Temperature 68°F ~ 77°F (20°C ~ 25°C)
Shipping Information -
Other product information

Advantage price,TS391SNL500C in stock can be shipped on the same day

In Stock: 7
Qty.Unit PriceExt. Price
1+ $172.6654 $172.6654
Enter Quantity:
Unit Price:
$0.47
Ext. Price:
$0.94
In Stock:
7
Minimum:
1
MPQ:
1
Multiples:
1
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